RTX-113T

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RTX-113T Electronic and Semiconductor Inspection X-Ray
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RTX-113SpecSheet3_06.pdf (116.7 KB)
RTX-113T
A unique X-ray inspection system, designed for rapid, reliable inspection of both multi-layer and assembled printed circuit boards
Applications:
  • Multi-Layer PCBs
  • Small Hole Drilling
  • BGA Inspection
  • Backplane Boards
 
Description
 
The RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGAs, uBGAs and Flip Chips.
The system is very versatile and features Glenbrook’s patented, award-winning X-ray camera technology that generates highresolution, high-sensitivity images, revealing defects as small as 0.001 inch with a full one inch diameter field of view. The RTX-113 provides affordable real-time X-ray imaging, reliable operation and easy servicing.
 
Specification
 
Dimensions: 44”H x 42”W x 24”D
(1066.8mm x 1117.6mm x 609.8mm)
Operating Voltage: 120v, 60hz or 220v, 50hz
Contrast Resolution: Can resolve .001 gold wire
Spatial Resolution: 20 lp/mm
(with MicroTech™ option, up to 100 lp/mm)
Anode Voltage: 35-52kV
Anode Current: 20-50 microamps
(internal adjustment)
Focal Spot to Image Plane Distance: 4-6 inches
X-ray Activation Mode: foot pedal or timer switch
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